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CVE-2023-33063

Qualcomm | Multiple ChipsetsAdded 2023-12-05Remediation Deadline 2023-12-26

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Required Action

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Weakness Classification

CWE-416

References

This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110